Filters
Location
Job Type
Full-time
Part-time
Contractual
Hourly
Intership
Intel
Intel Penang Malaysia
2 weeks ago
Job Description
Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.The Disaggregation Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.The Penang Disaggregated Manufacturing (PGDM) Production Engineer will be... responsible for benchmarking, developing, implementing and continuously improving operational standards and business processes and systems to enable consistent high velocity, high volume output of a semiconductor fab. The Production Engineer:Integrates, tests, configures, and/or supports automated Factory mfg systems/tools. Coordinates factory requirements, maps them to automation/mfg systems capabilities, and recommends technical solutions. Applies advanced troubleshooting to automation/mfg system problems. Drives continuous improvement efforts to expand/optimize systems use, as well as bringing forward new, emerging capabilities and improved visual info tools. Serves as site expert for a designated set of automation/mfg systems, acting as an integrator/facilitator of cross-functional and cross-site (VF, Virtual Factory) teams (partners with Mfg/ROC Eng, Automation/MIT/AMHS, Planning, IE, Production, Process Engineering, Integration/Yield). Lead mfg readiness (getting these systems/tools in place) for new technologies and adapting to ongoing technology changes.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: - Proficiency with High Volume Manufacturing (HVM) manufacturing reporting, tools, and automation systems- Must have an excellent track record of leading/driving improvements and change across organizations and shifts.- Must have at least 4 years of leadership experience of complex manufacturing processes.- 4-year STEM degree required. Preferred Qualifications:-Experience leading teams in new factory / production line startup-proficiency in JMP, SQL-PF, Power BI, PythonRequirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Understanding and application of manufacturing methodologies and principles (manufacturing science/factory physics) and line management strategies and tactics.- Understanding and application of Quality Control systems, Model Based Problem Solving, and LEAN principles.- Ability to learn new, complex systems and leverage them to optimize factory performance.- Ability to effectively communicate ideas using written and verbal means to all levels of the organization.- Ability to partner, influence, negotiate, and drive accountability across diverse functional teams in a dynamic environment.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html
Working Model
This role will require an on-site presence
Penang Malaysia
Salary Criteria
Suggestions
Robert.D
Robert.D
Robert.D
Robert.D
Robert.D
Copyright © 2023 Fonolive. All rights reserved.