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  • Senior Engineer, Packaging Engineering Malaysia
  • Western Digital in Malaysia, , Malaysia
  • jobs
  • 2 weeks ago

jobs description

Company Description

The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.

Job Description
• This position will interface with wafer fab, mainly NAND and ASIC, package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams.
• In this position... you will be responsible for influencing package and product design by addressing structural reliability issues particularly and advancing the technology of semiconductor packaging generally.
• Fab process and design understanding and background is preferred.
• As a CPI (chip package integration) engineer, you're responsible for chip structure optimization, package evaluation for Fab process change, package recipe baseline development, etc.

Qualifications
• M.S. or above in Material and Science Engineering, Micro-electronics Engineering, Mechanical Engineering, Semiconductor, Chemical, etc.
• Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
• Good understanding of Fab process, wafer design and D/S, KGD, MT testing.
• Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.
• Strong oral and written communication skills, especially in English, etc.
• Demonstrated strong work ethic.
• Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
• Solid background in applied mechanics and computational techniques is required.
• In-depth knowledge of IC packaging is highly desired.
• Skilled in DOE design and statistical analysis tools is preferred.
• Self-motivated, hardworking, teamwork.

Additional Information

Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity. Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to compliance@wdc.com
Malaysia

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