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Job Description
• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP / modules, Power QFN, Wafer level, flip-chip, multi-chip module and power device packaging.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT / CM to develop, run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitor to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT / CM to monitor and resolve process issues... early in the production stage to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP / modules, wafer level packaging & flip chip interconnects.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Establish & maintain package design rules.

• Doctorate / Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP / module, wafer level & flip-chip packaging.
• Strong understanding of power SiP / modules which has an Inductor and capacitors with soldering, assembly process knowledge, qualification methods, SPC and statistical analysis software.

Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Additional Information

Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier.

The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions.

These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

Learn more at www.renesas.com .

Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial.

Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, disabilities, military status, veteran status, or any other basis protected by law.

For more information, please read our Diversity & Inclusion Statement
Zhubei Zhubei City Hsinchu County


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