Loading...

@

  • ADVANCED PACKAGING TD - ENGINEER PROCESS INTEGRATION North District
  • Micron in North District, Taichung City, Taiwan
  • jobs
  • 1 month ago

jobs description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR44444 ADVANCED PACKAGING TD - ENGINEER PROCESS INTEGRATIONAs a process integration engineer in Micron’s Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for process development with integration scheme for memory devices application.In this position, you will work with process module team, data science team, defect team to develop unit processes that meet product spec and device requirements for HBM products.Additionally, real time yield and defect analysis, inline WIP control and escalate for any potential issues are needed.RESPONSIBILITIES:Yield and quality improvement for HBM products to support product milestone deliverables.Develop... and lead integrationprocesses from the conceptual phase to high-volume production for highly complex package development challenges.Work closely with multiple cross functional teams including defect team, probe testing team, and process module team.Able to work independently along with various projects inside of APTD team.Basic Qualifications:Bachelor’s degree in physics, chemistry, electrical engineering, mechanical engineering, material science, or other applied engineering discipline.Understanding on technical risk assessment, setup mitigation plan, FMEA, and SPC.Verbal and written communication skills in EnglishPreferred Qualifications:Strong focus on advanced package technology ( or 3Dpackage, heterogeneous integration, or fan-out wafer level) research and development.Depth in packaging technologies such as BGA, fcCSP, WLCSP, SIP, TSV, and SOC.Hands on experience on flip chip die attach, thermo-compressive bonding, wafer clean, plasma activation.Understanding on statistical process control and development with structured DOE.Understanding on various PFA analysis and methodHighly skilled at problem-solving activity and capability of leadingcross functional team
North District Taichung City Taiwan

salary-criteria

Apply - ADVANCED PACKAGING TD - ENGINEER PROCESS INTEGRATION North District